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Semiconductor Engineering
2 个月
Chip Industry Week In Review
More nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; SDV challenges; EDA, IP, and chip sales up; ML ...
Semiconductor Engineering
1 天
Security Concerns Weigh Down Open-Source EDA
Open-source EDA tools are free, readily available, and growing in numbers, but many chipmakers are wary of using them due to ...
Semiconductor Engineering
1 天
Confidential Computing: A Key To Secure Cloud And Edge Environments
The foundation of the TEE is called a Root of Trust (RoT), which is based on a secure key unique to each processor. The ...
Semiconductor Engineering
1 天
Challenges In Reducing Wireless Latency
New protocols and technology will spur a whole new wave of chips, but those designs will be significantly more complicated.
Semiconductor Engineering
1 天
Radar-Based Vital Signs Detection For In-Cabin Applications
In-cabin sensing is an emerging area in the automotive industry, and radars play an integral role in this area. With the Euro ...
Semiconductor Engineering
1 天
Lightweight, High-Performance CPU Extension for Protected Key Handles with CPU-Enforced ...
A Lightweight ISA Extension for Protected Key Handles with CPU-enforced Usage Policies” was published by researchers at CISPA ...
Semiconductor Engineering
1 天
CMA/SPDM—An Additional Layer of Security for PCIe Transport
Keys: The secret codes or pairs of codes that lock and unlock the message through the algorithm.
Semiconductor Engineering
1 天
Chiplet-Level HI of Polymer-Based Circuits For Fabricating Flexible Electronic-Photonic ...
A technical paper titled “Flexible electronic-photonic 3D integration from ultrathin polymer chiplets” was published by ...
Semiconductor Engineering
1 天
Improving The Gate Oxide Reliability in Gate First HKMG DRAM Structures (Sungkyunkwan Univ ...
A new technical paper titled “Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM” was published by ...
Semiconductor Engineering
1 天
Managing Legacy In Automotive
As vehicle technology evolves, carmakers must decide which technologies move forward and what gets left behind.
Semiconductor Engineering
4 天
Government Chip Funding Spreads Globally
Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.
Semiconductor Engineering
2 天
Blog Review: Oct. 9
ECAD-MCAD collaboration; AXI4 locking mechanism; SRAM PUF; ADAS challenges; gate resistance; Gemini AI’s network comms.
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