Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, ...

Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, ...

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

Altera revealed new details on its next-generation, power- and cost-optimized Agilex 3 FPGAs and announced new development kits and software support for its Agilex 5 FPGAs. “Working closely with our ...

Mitsubishi announced that all success criteria, including an additional success, were achieved without performance degradation during a six-month on-orbit demonstration of its laser source module ...

Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...

Intel and Amazon Web Services (AWS) announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant ...

Yole reported that the advanced IC substrate market currently dominated by organic core substrates, saw revenue decline in 2023, marking a year of correction. Further findings shared by Yole includes: ...

Navitas Semiconductor announced the release of a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages. Navitas’ ...

Qualcomm expanded its Snapdragon X Series portfolio with the introduction of Snapdragon X Plus 8-core, a breakthrough platform that unleashes multiday battery life, unprecedented performance and ...

5G RedCap was finalized in the 3GPP’s Release 17 to provide device OEMs with a migration pathway from 4G LTE to 5G for mid-range devices, whose throughput requirements sit between those of enhanced ...

SK hynix has begun mass production of the world’s first 12-layer HBM3E product with 36GB1, the largest capacity of existing HBM2 to date. Previously, the maximum capacity of HBM3E was 24GB from eight ...